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XIC Co., Ltd.

We set the standard for the semiconductor industry with cutting-edge technology.

Company Greetings

Greetings

Hello. We sincerely thank you for visiting the XIC Co., Ltd. website.

BEYOND INNOVATION, INTO PRECISION

The advent of the AI ​​(Artificial Intelligence) era is bringing about many unpredictable changes to all industrial sectors, including the existing semiconductor industry.

In particular, the importance of semiconductor packaging technology for implementing AI (Artificial Intelligence) accelerators is increasing. As a company established to develop and commercialize core components and equipment necessary for the semiconductor packaging technology field, we have prioritized trust and quality since our inception by reflecting customer requirements and providing new technologies and solutions that meet those needs. Moving forward, we will continue to provide better services and solutions through ceaseless innovation and challenges, striving to become a company that contributes to our customers and society. Thank you.

Vision

Leading Supplier of Advanced Semiconductor Packaging Processes & Substrate Components

Mission & Goal

  • Mass production and supply of semiconductor packaging components and expansion of market share

  • Coining head market share 40%

  • Pulse Heater & Attach Tool (SiC Single Crystal Application) Market Share 20%

Core Values: 4C

  • Collabolation

    Organic cooperation and trust-based communication

  • Creativity

    Creative and continuous research and development for the application of new technologies

  • Customer Satisfaction

    Customer-centered product supply

  • Challenge

    Challenges in New Product Development in Response to Market Changes