XIC is a company that develops core components and technologies for advanced semiconductor processes.
We will grow into a trusted partner through customer-centric technological innovation.
XIC is a company that has continued its growth and innovation in the field of semiconductor process components.
We are strengthening our competitiveness through accumulated experience and technology.
XIC operates a systematic organization centered on specialized personnel in each field.
We provide stable quality and service through inter-departmental cooperation.
XIC is recognized for its technological capabilities through various certifications based on quality standards.
We are securing customer trust through continuous quality improvement.
We create synergy among customers, partners, and members through organic cooperation and trust-based communication.
We develop differentiated technologies and innovative products through creative thinking and continuous research and development.
We achieve high quality and trust by providing customer-centric products and services.
We respond to the changing market and constantly challenge ourselves to develop new technologies and products.
A pulse heater is a high-speed heating heater used in the TC Bonding (Thermo Compression Bonding) process during semiconductor packaging, and is a core process device that precisely bonds a chip and a substrate using heat and pressure.
XIC’s Pulse Heater is a high-performance heating solution designed based on SiC single-crystal processing technology, providing performance optimized for advanced semiconductor packaging processes through rapid heating and stable temperature control.
The Attach Tool is a core process component used in the semiconductor packaging process to accurately position chips on a substrate and securely bond them. It plays a crucial role in enhancing the quality and productivity of the packaging process through precise position control and stable pressure transmission.
XIC's Attach Tool provides high durability and stable performance by applying SiC-based material technology and precision machining technology. It is designed to meet the precision and reliability required for advanced packaging processes and to adapt to various semiconductor packaging process environments.
The Coining Head is a process component in the semiconductor package substrate production process that creates a stable bonding environment by uniformly flattening the height of bumps. It plays an important role in improving the quality of the packaging process through precise pressure control.
XIC's Coining Head provides stable process performance based on high-precision machining technology and excellent durability. Through a design optimized for advanced semiconductor packaging substrate processes, it supports high reliability and a stable operating environment for a long period.
